Enroll Course: https://www.coursera.org/learn/advanced-packaging
In the rapidly evolving world of microelectronics, the physical layout and assembly of components – what we call semiconductor packaging – is no longer an afterthought. It’s a critical driver of innovation and performance. This realization is precisely what the Coursera course, ‘Advanced Semiconductor Packaging,’ expertly delivers.
This course, taught by industry experts including Intel Fellow Ravi Mahajan, dives deep into the technologies shaping the future of computing and communication. It begins by tracing the evolution of packaging, demonstrating its profound impact on product performance. We learn how packaging has moved from a simple protective shell to an active enabler of complex functionalities.
The core of the course revolves around ‘Heterogeneous Integration’ (HI). This concept is crucial: it’s about combining different types of chips and technologies into a single package. The course meticulously explains how advancements in interconnects – the pathways that allow these chips to communicate – are key to achieving this. Whether it’s improving thermal management, ensuring signal integrity, or enabling intricate multi-chip packages (MCPs), the course breaks down the technical details.
Dr. Mahajan masterfully guides learners through the nuances of interconnect scaling, exploring both 2D and 3D architectures. He highlights the importance of standardization for die-to-die (D2D) interconnects, paving the way for systematic and modular design. Furthermore, the course looks ahead, discussing how co-packaging optics can tackle the growing challenge of off-package bandwidth scaling – a vital consideration for future high-performance systems.
The syllabus is structured logically, starting with a broad overview of packaging trends and then progressively focusing on the intricate details of heterogeneous integration. The concluding module effectively summarizes the key takeaways, reinforcing the concepts of interconnect scaling, MCP design, and the future potential of co-packaged optics.
For anyone involved in electronics design, semiconductor manufacturing, or even those simply fascinated by the inner workings of our modern devices, ‘Advanced Semiconductor Packaging’ is an invaluable resource. It provides a clear, expert-led journey into a field that is quietly revolutionizing the technology we use every day. I highly recommend this course for its depth, clarity, and forward-looking perspective.
Enroll Course: https://www.coursera.org/learn/advanced-packaging