Enroll Course: https://www.coursera.org/learn/advanced-packaging
The realm of semiconductor technology is constantly evolving, and staying ahead requires a deep understanding of the latest packaging innovations. Coursera’s ‘Advanced Semiconductor Packaging’ course offers a comprehensive exploration into the pathway for assembly and packaging technologies, focusing on 7-nanometer silicon feature sizes and beyond. Led by industry expert Ravi Mahajan, an Intel Fellow and Director at Intel, this course delves into how packaging has transformed product performance and driven innovation through heterogeneous integration.
The course structure is thoughtfully designed, beginning with an overview of packaging trends and their evolution. Students learn about the critical role of advanced packaging in integrating diverse components and functionalities, which is essential for future computing and communication systems. The modules on interconnect scaling and multi-chip packages (MCPs) provide valuable insights into the trade-offs and technological options like 2D and 3D architectures.
One of the standout features of this course is its emphasis on real-world applications, such as how interconnects enhance thermal management and signal integrity. Discussions on D2D interconnects, standardization, and co-packaging optics reveal the strategic approaches employed by leading tech companies to address bandwidth and performance challenges.
I highly recommend this course to engineers, researchers, and students eager to deepen their understanding of semiconductor packaging. It provides not only theoretical knowledge but also practical insights into current industry trends and future directions. Whether you are looking to enhance your skills for career advancement or to stay updated with cutting-edge technology, this course is an invaluable resource.
Enroll today and join the forefront of innovation in microelectronics!
Enroll Course: https://www.coursera.org/learn/advanced-packaging